When humidity exceeds 80%, electronic devices absorb moisture, leading to increased weight, expansion, and deformation. The corrosion rate of metal components also accelerates, while the insulation resistance of dielectric materials decreases—even risking insulation breakdown, which can result in equipment failure. Damp environments further promote mold growth, and the weak acids secreted by mold can corrode and damage the fine metal traces on circuit boards, thereby impairing circuit functionality.
Moisture Issues: mold growth, short circuit faults, performance damage, structural destruction
Moisture Prevention Recommendations
Apply a protective layer on the product surface.
Place calcium chloride desiccant inside the packaging to promptly absorb any excess moisture.
Monitor the temperature and humidity of the warehouse, andmaintain relative humidity within an appropriate range.
Container desiccants are used in shipping containers to effectively prevent container rain.
